CC1312R7 Module, +33dBm, N533LS
- Detail
- Parameters
Radio module based TI CC1312R7 transceiver, high power PA and LNA.
N533LS CC1312R74T0RGZR transceiver high power module designed for 868M and 915Mhz band. Up to +33 dBm output power, down to -112 dBm sensitivity.
N533LS integrated TI CC1312R7 transceiver, high power PA and LNA chip, suitable for 868MHz and 915M band. Maximum output power is 33dBm. CC1312R7 module has the characteristics of low cost, low power consumption and small size. The module is designed with 4-layer board, with excellent impedance matching and anti-interference. The module is mainly for IoT, intelligent home, wireless meter reading, scientific research and medical treatment, and medium and long-distance wireless communication equipment. N533LS leads all pins out for secondary development.
N533LS high power module (CC1312R7 ) is suitable for free frequency band in China.
RF Interface | Parameter | Introduce |
Frequency | 868MHz, 915MHz | Support ISM |
Output Power | +33 dBm | The maximum power 2000mW |
Sensitivity | -112dBm | 50kbps |
Symbol Rate | 0.3-2000 kbps | Software programming control |
Deviation | +/-10kHz | Antenna interface |
Distance | 14000m | In clear and open environment, the antenna gain is 3 dBi, the height above the ground is 2.5 meters, and the air speed is 1.2 kbps. |
Hardware parameters | Value | Remarks |
Size | 36 x 22 x 3mm | - |
Antenna Interface | IPEX, stamp hole | - |
Communication Interface | UART, SPI | Software programming |
Package | SMD | - |
Electrical Parameters | Minimum | Typical | Maximum | Remarks |
Volt | 1.8V | 3.3V | 3.9V | |
PA Volt | 3V | 5V | 6V | |
Emission Current | 1200mA | Instantaneous power consumption | ||
Receiving Current | 17mA | - | ||
Sleep current | 1uA | Software programming control | ||
Working Temperature | -30℃ | 75℃ | - |
Datasheet download
Ordering information
N533LS-868M CC1312R7+PA 33dbm, 860Mhz-880Mhz
N533LS-915M CC1312R7+PA 33dbm, 910Mhz-930Mhz
Other modules
N531AS-433M CC1312R 14dbm, 410Mhz-510Mhz
N531AS-868M CC1312R 14dbm, 860Mhz-960Mhz
N533FS-433M CC1312R+PA 24dbm, 410Mhz-510Mhz
N533FS-868M CC1312R+PA 24dbm, 860Mhz-960Mhz
N621PA-868M CC1312R+CC1190 27dbm, 860Mhz-880Mhz
N621PA-915M CC1312R+CC1190 27dbm, 910Mhz-930Mhz
N533ES-433M CC1312R+PA 30dbm, 410Mhz-440Mhz
N533ES-490M CC1312R+PA 30dbm, 470Mhz-510Mhz
N533ES-868M CC1312R+PA 30dbm, 860Mhz-880Mhz
N533ES-915M CC1312R+PA 30dbm, 910Mhz-930Mhz
Other Dongle
N535AP-433M CC1312R 14dbm, 410Mhz-510Mhz
N535AP-868M CC1312R 14dbm, 860Mhz-960Mhz
Test method of N533LS high power module
Take the supporting base plate of Heyan technology as an example:
The bottom board of N533LS is T532AP, which integrates USB to serial chip, led, button, burning port and module card port. As shown in the figure:
N533LS secondary development method:
The CC1312R7 high power module is stuck on the backplane as shown in the figure, and the IPEX is connected with the antenna. The burning port is connected with xds110 according to the silk screen printing, and then online simulation can be carried out to test the performance of the module.
Module Programming
The schematic diagram of the module base plate can be obtained from our official website.
Please contact us for specific programming information or download it from TI official website www.ti.com.
Files download