Radio module based CC1312R.

N531BS CC1312R   module designed for 169M, 433M,   868MHz and 915MHz band. AT command support.

N531BS integrated TI CC1312R chip, suitable for169M,   433M, 868MHz, 915MHz band. N531BS module has the characteristics of low cost, low power consumption and small size. Module is mainly for IoT, intelligent home, wireless meter reading, scientific research and medical treatment, and medium and long-distance wireless communication equipment. N531BS leads all pins out of CC1312R chip for secondary development.

N531BS (CC1312R) is suitable for free frequency band in EU and USA.

CC1312R Introduce

The SimpleLink™CC1312R device is a multiprotocol Sub-1 GHz wireless microcontroller (MCU) supporting IEEE 802.15.4g, IPv6-enabled smart objects (6LoWPAN), MIOTY, Wi-SUN, proprietary systems, including the TI 15.4-Stack (Sub-1 GHz). The device is optimized for low-power wireless communication and advanced sensing in building security systems, HVAC, smart meters, medical, wired networking, portable electronics, home theater & entertainment, and connected peripherals markets. The highlighted features of this device include:

• Flexible Sub-1 GHz radio supporting industry standard frequency bands (315 MHz, 433 MHz, 868 MHz, 900 MHz, and more) to meet the industrial needs.

• Wide flexibility of protocol stack support in the SimpleLink™ CC13x2 and CC26x2 Software Development Kit (SDK) including complete SimpleLink™ 15.4-Stack (Sub-1 GHz) solution.

• Maximum transmit power of +14 dBm at Sub-1 GHz with 24.9 mA current consumption.

• Longer battery life wireless applications with low standby current of 0.85 µA and full RAM retention.

• Industrial temperature ready with lowest standby current of 11 µA at 105°C.

• Advanced sensing with a programmable, autonomous ultra-low power Sensor Controller CPU with fast wake-up capability. As an example, the sensor controller is capable of 1-Hz ADC sampling at 1 µA system current.

• Low SER (Soft Error Rate) FIT (Failure-in-time) for long operation lifetime with no disruption for industrial markets with always-on SRAM parity against corruption due to potential radiation events.

• Dedicated software controlled radio controller (Arm® Cortex®-M0) providing flexible low-power RF transceiver capability to support multiple physical layers and RF standards.

• Excellent radio sensitivity (-121 dBm) and robustness (selectivity and blocking) performance for SimpleLink™ long-range mode.

The CC1312R device is part of the SimpleLink™ MCU platform, which consists ofWi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub-1 GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100 percent code reuse when your design requirements change. For more information, visit SimpleLink™ MCU platform.

ISM Frequency supported by N531BS module

169M band: 169 MHz to 170 MHz (China, EU)

433M band: 433 MHz to 435 MHz (China, EU)

470M band: 470 MHz to 510 MHz (China)

770M band: 770 MHz to 780 MHz (China)

868M band: 868 MHz to 870 MHz (China, EU, USA)

                       888 MHz to 889 MHz (Australia)

915M band: 902 MHz to 928 MHz (USA)

If you need N531BS module to support other frequencies, please contact us.

‍Download N531BS datasheet

Ordering information

N531BS-433M    CC1312R chip     14dBm, 410M-510MHz

N531BS-868M    CC1312R chip     14dBm, 860M-960MHz

Other modules

N533FS-433M     CC1312R+PA              24dbm, 410Mhz-510Mhz

N533FS-868M     CC1312R+PA              24dbm, 860Mhz-960Mhz

N623PA-868M     CC1312R+CC1190     27dbm, 860Mhz-880Mhz

N623PA-915M     CC1312R+CC1190     27dbm, 910Mhz-930Mhz

N533ES-433M     CC1312R+PA             30dbm, 410Mhz-440Mhz

N533ES-490M     CC1312R+PA             30dbm, 470Mhz-510Mhz

N533ES-868M     CC1312R+PA             30dbm, 860Mhz-880Mhz

N533ES-915M     CC1312R+PA             30dbm, 910Mhz-930Mhz

Test method of N531BS module

Take the supporting base plate of Heyan technology as an example:

The bottom board of N531BS is T532AP, which integrates USB to serial chip, led, button, burning port and module card port. As shown in the figure:

N531BS secondary development method:

The CC1312R module is stuck on the backplane as shown in the figure, and the IPEX is connected with the antenna. The burning port is connected with xds110 according to the silk screen printing, and then online simulation can be carried out to test the performance of the module.

Module Programming

The schematic diagram of the module base plate can be obtained from our official website.

Please contact us for specific programming information or download it from TI official website www.ti.com.