Radio module based TI CC1310 chip.
N530AS integrated TI CC1310F128 chip, suitable for 433M, 868MHz, 915MHz band. CC1310 module has the characteristics of low cost, low power consumption and small size. Module is mainly for IoT, intelligent home, wireless meter reading, scientific research and medical treatment, and medium and long-distance wireless communication equipment. N530AS leads all pins out of CC1310 chip for secondary development.
N530AS (CC1310) is suitable for free frequency band in EU and USA.
The CC1310 device is a cost-effective, ultra-low-power, Sub-1 GHz RF device from Texas Instruments™ that is part of the SimpleLink™ microcontroller (MCU) platform. The platform consists of Wi-Fi®, Bluetooth® low energy, Sub-1 GHz, Ethernet, Zigbee®, Thread, and host MCUs. These devices all share a common, easy-to-use development environment with a single core software development kit (SDK) and a rich tool set. A one-time integration of the SimpleLink platform enables users to add any combination of devices from the portfolio into their design, allowing 100 percent code reuse when design requirements change. For more information, visit www.ti.com/simplelink.
With very low active RF and MCU current consumption, in addition to flexible low-power modes, the CC1310 device provides excellent battery life and allows long-range operation on small coin-cell batteries and in energy harvesting applications.
The CC1310 is a device in the CC13xx and CC26xx family of cost-effective, ultra-low-power wireless MCUs capable of handling Sub-1 GHz RF frequencies. The CC1310 device combines a flexible, very low-power RF transceiver with a powerful 48-MHz Arm® Cortex®-M3 microcontroller in a platform supporting multiple physical layers and RF standards. A dedicated Radio Controller (Cortex®-M0) handles low-level RF protocol commands that are stored in ROM or RAM, thus ensuring ultra-low power and flexibility. The low-power consumption of the CC1310 device does not come at the expense of RF performance; the CC1310 device has excellent sensitivity and robustness (selectivity and blocking) performance.
The CC1310 device is a highly integrated, true single-chip solution incorporating a complete RF system and an on-chip DC/DC converter.
Sensors can be handled in a very low-power manner by a dedicated autonomous ultra-low-power MCU that can be configured to handle analog and digital sensors; thus the main MCU (Arm® Cortex®-M3) can maximize sleep time.
The power and clock management and radio systems of the CC1310 device require specific configuration and handling by software to operate correctly, which has been implemented in the TI-RTOS. TI recommends using this software framework for all application development on the device. The complete TI-RTOS and device drivers are offered free of charge in source code.
ISM Frequency supported by N530AS module
433M band: 433 MHz to 435 MHz (China, EU)
470M band: 470 MHz to 510 MHz (China)
779M band: 770 MHz to 780 MHz (China)
868M band: 868 MHz to 870 MHz (China, EU, USA)
888 MHz to 889 MHz (Australia)
915M band: 902 MHz to 928 MHz (USA)
If you need N530AS module to support other frequencies, please contact us.
N530AS (CC1310) is suitable for free frequency band in EU.
|Frequency||433M, 860M, 960MHz|
|Module Size||24.8 x 18.6 x 3mm|
|Antenna Interface||IPEX, stamp hole|
|Communication Interface||UART, SPI|
N530AS-433M CC1310 14dBm, 410M-510MHz
N530AS-868M CC1310 14dBm, 860M-960MHz
N532FS-433M CC1310+PA 24dbm, 410Mhz-510Mhz
N532FS-868M CC1310+PA 24dbm, 860Mhz-960Mhz
N620PA-868M CC1310+CC1190 27dbm, 860Mhz-880Mhz
N620PA-915M CC1310+CC1190 27dbm, 910Mhz-930Mhz
N532ES-433M CC1310+PA 30dbm, 410Mhz-440Mhz
N532ES-490M CC1310+PA 30dbm, 470Mhz-510Mhz
N532ES-868M CC1310+PA 30dbm, 860Mhz-880Mhz
N532ES-915M CC1310+PA 30dbm, 910Mhz-930Mhz
Test method of N530AS module
Take the supporting base plate of Heyan technology as an example:
The bottom board of N530AS is T532AP, which integrates USB to serial chip, led, button, burning port and module card port. As shown in the figure:
N530AS secondary development method
The CC1310 module is stuck on the backplane as shown in the figure, and the IPEX is connected with the antenna. The burning port is connected with xds110 according to the silk screen printing, and then online simulation can be carried out to test the performance of the module.
The schematic diagram of the module base plate can be obtained from our official website.
Please contact us for specific programming information or download it from TI official website www.ti.com.