N532DS radio module based CC1311R3 and PA.
N532DS integrated TI CC1311R3 and PA chip, which is suitable for 433M, 868MHz and 915MHz band. CC1311 module has the characteristics of low cost, low power consumption and small size. The module is designed with 4-layer board, with excellent impedance matching and anti-interference. The module is mainly for Internet of things, intelligent home, wireless meter reading, scientific research and medical treatment, and medium and long-distance wireless communication equipment. CC1311 module leads all pins out for secondary development.
N532DS (CC1311R3) is suitable for free frequency band in EU.
RF Interface | Parameter | Introduce |
Frequency | 433M, 860M, 915MHz | Support ISM |
Output Power | +24dBm | The maximum power 200mW |
Sensitivity | -110dBm | 50kbps |
Symbol Rate | 0.3-4000kbps | Software programming control |
Deviation | +/-10kHz | Antenna interface |
Distance | 4000m | In clear and open environment, the antenna gain is 3 dBi, the height above the ground is 2.5 meters, and the air speed is 1.2 kbps. |
Hardware parameters | Value | Remarks |
Size | 32 x 22 x 3mm | - |
Antenna Interface | IPEX, stamp hole | - |
Communication Interface | UART, SPI | Software programming |
Package | SMD | - |
Electrical Parameters | Minimum | Typical | Maximum | Remarks |
Volt | 1.8V | 3.3V | 3.9V | |
PA Volt | 3V | 5V | 6V | |
Emission Current | 200mA | Instantaneous power consumption | ||
Receiving Current | 6.9mA | - | ||
Sleep current | 1uA | Software programming control | ||
Working Temperature | -30℃ | 75℃ | - |
Pin Definition
Test method of N532DS module
Take the supporting base plate of Heyan technology as an example:
The bottom board of N532DS is T532AP, which integrates USB to serial chip, led, button, burning port and module card port. As shown in the figure:
N532DS secondary development method:
The CC1311 module is stuck on the backplane as shown in the figure, and the IPEX is connected with the antenna. The burning port is connected with xds110 according to the silk screen printing, and then online simulation can be carried out to test the performance of the module.
Module Programming
The schematic diagram of the module base plate can be obtained from our official website.
Please contact us for specific programming information or download it from TI official website www.ti.com.
Files download
N532DS CC1311R3 Datasheet CC1311R3 Datasheet
Order Information
N532DS-CC1311R3-169M CC1311R3 160M - 175Mhz 24dBm
N532DS-CC1311R3-433M CC1311R3 410M - 510Mhz 24dBm
N532DS-CC1311R3-868M CC1311R3 860M - 930Mhz 24dBm
N532DS-CC1311R3-1200M CC1311R3 1200M - 1250Mhz 24dBm